IPC-2221 Equation:
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The IPC-2221 equation calculates the minimum trace width needed to carry a given current while keeping the temperature rise within acceptable limits. It's a standard for printed circuit board (PCB) design.
The calculator uses the IPC-2221 equation:
Where:
Explanation: The equation accounts for the relationship between current, temperature rise, and trace cross-sectional area.
Details: Proper trace width is crucial for PCB reliability. Too narrow traces can overheat, causing failure or fire risk, while too wide traces waste space.
Tips: Enter current in amps, temperature rise in °C, copper thickness in mils (1 mil = 0.001 inch), and k constant (typically 0.048). All values must be positive.
Q1: What's the difference between internal and external traces?
A: External traces can dissipate heat better, hence the different k values (0.024 for external, 0.048 for internal).
Q2: What's a typical temperature rise limit?
A: Common limits are 10°C or 20°C, but depends on application requirements.
Q3: What about high current applications?
A: For very high currents, consider using multiple layers or bus bars instead of just increasing trace width.
Q4: Does this account for ambient temperature?
A: No, ΔT is the temperature rise above ambient. The actual trace temperature would be ambient + ΔT.
Q5: What's the typical copper thickness?
A: Common thicknesses are 0.5 oz (0.7 mils), 1 oz (1.4 mils), and 2 oz (2.8 mils) per square foot.